| 摘要 |
PURPOSE: An apparatus and a method for testing a wire are provided to minimize the defective proportion of a semiconductor package by testing the short circuit of a wire, the opening state of the wire, and the leak current of the wire. CONSTITUTION: An apparatus for testing a wire includes a strip PCB(Printed Circuit Board), a plurality of alignment pins, an alignment driving portion, a socket(714), a signal supply portion, and a socket driving portion. The strip PCB has two or more alignment pinholes and contact points. The alignment pins are inserted into the alignment pinholes in order to align the strip PCB. The alignment driving portion drives the alignment pins. The socket includes a plurality of socket pins which are in contact with the contact points of the strip PCB. The signal supply portion supplies the current to the strip PCB through the socket. The socket driving portion moves the socket to an upper portion or a lower portion. |
