| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit board, capable of forming a high-density wiring pattern and reliably performing interlayer connection using a conductive paste. SOLUTION: A masking tape 15 is stuck on a surface of a copper foil 12 on one side of a board 11. Openings 15a and 12a are formed in the masking tape 15 and the copper foil 12, respectively, and a via hole 16 is formed in the board 11 while communicating with the opening 12a. A conductive paste 18 is filled into the via hole 16, and hot pressing is applied on the conductive paste 18 after the masking tape 15 is peeled off. The conductive paste 18 in the via hole 16 is pressed to be formed in a rivet shape, and an etching resist 19a is provided on a surface of the board. A size of the etching resist 19a on the via hole 16 is formed to be smaller than a size of a desired land part 20 formed of the copper foil 12. When etching is performed, the etching is completed in such a state where a part of an expanding part 18a around the via hole 16 is left while the fringe portion of the extending part is removed by the etching. COPYRIGHT: (C)2011,JPO&INPIT |
