| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in balance of various properties such as resolution, profile, sensitivity, focal depth and heat resistance and free of scum. <P>SOLUTION: The photosensitive resin composition for production of an integrated circuit comprises an o-quinonediazide compound and a novolac resin obtained by condensing a compound of formula (IV) (where R<SB>13</SB>-R<SB>18</SB>are independently H, a ≤6C alkyl, a ≤6C cycloalkyl, a ≤6C alkoxy or a ≤6C alkenyl; R<SB>19</SB>is H, a ≤6C alkyl or a ≤10C aryl; p and q are independently 1 or 2; and r is 0 or 1; but at least one of R<SB>13</SB>-R<SB>15</SB>is a ≤6C cycloalkyl), phenols of formula (V) (where R<SB>20</SB>-R<SB>22</SB>are independently H, a ≤6C alkyl, a ≤6C cycloalkyl, a ≤6C alkoxy or a ≤6C alkenyl and k is 1 or 2) and aldehydes. <P>COPYRIGHT: (C)2003,JPO |
