WAFER BUMPING METHOD AND PRINTING MASK USING SOLDER PASTE PRINT

摘要

PURPOSE: A wafer bumping method is provided to shorten a time interval of forming a bump and improve uniformity of solder paste by making a printing mask filled with the solder paste while using a rubber squeezer. CONSTITUTION: A wafer(W) is vacuum-absorbed and closely attached to a wafer supporting block. The printing mask is closely attached to the surface of the wafer. The solder paste(P) is filled in a hole of the printing mask by using the rubber squeezer. The printing mask is eliminated by using a mask guide apparatus. The wafer is reflowed in a furnace to make the solder melted and attached to an electrode pad(4). A cleaning process is performed on the surface of the wafer.