发明名称 Manufacturing method of semiconductor device using mask pattern having high etching resistance
摘要 A manufacturing method of semiconductor device comprises forming a mask material having an aromatic ring and carbon content of 80 wt % or more on an object, forming a mask material pattern by etching the mask material to a desired pattern, and etching the object to transfer the mask material pattern as a mask to the object.
申请公布号 US6576562(B2) 申请公布日期 2003.06.10
申请号 US20010014459 申请日期 2001.12.14
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 OHUCHI JUNKO;SATO YASUHIKO;SHIOBARA EISHI;HAYASHI HISATAKA;OHIWA TOKUHISA;ONISHI YASUNOBU
分类号 H01L21/027;H01L21/288;H01L21/311;H01L21/3205;H01L21/768;(IPC1-7):H01L21/302 主分类号 H01L21/027
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