| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer-drying apparatus that can efficiently dry a semiconductor wafer reduce residual particles and its costs. SOLUTION: In the wafer-drying apparatus, a wafer 100 is heated by a heating lamp 4 or the like for preventing adhering water from freezing when pressure inside a chamber 1 is reduced for evaporating the adhering water in the wafer 100, thus efficiently drying the wafer, and reducing residual particles and its costs.
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