| 摘要 |
PROBLEM TO BE SOLVED: To protect photoresist against cracking or chipping so as to provide a coil free from short-circuiting and to provide its manufacturing method. SOLUTION: A coil pattern is formed on a board by the use of photoresist, then conductor is grown on openings provided to the resist through a plating method, and then the board is removed. When conductor is grown on the surface where the board is removed through a plating method, a fat component is applied or alkaline processing is carried out, by which a gap is restrained from being produced between the photoresist and the fat all over a coil. The photoresist deforms following the resin, and a gap is produced between the photoresist and the resin all over the coil. |
