Production of a semiconductor wafer comprises removing the wafer from a single crystal which is rotated about its longitudinal axis using the cutting wires of two saw guides

摘要

Production of a semiconductor wafer comprises removing the wafer from a single crystal which is rotated about its longitudinal axis using the cutting wires of two saw guides. Preferred Features: One saw guide is not moved and one saw guide is rotated until the cutting wires are aligned parallel to the cutting wires of the non-moving guide. The parallel rotational symmetrically curved sides of the wafer are produced by lapping or grinding.