| 摘要 |
PROBLEM TO BE SOLVED: To provide a miniaturized solid-state image sensing device at a reduced cost. SOLUTION: A semiconductor substrate 10 comprises an image pickup area 14 in which a plurality of optical sensors are arrayed on the surface thereof, and a transparent plate 6 of the same form and the same size as the semiconductor substrate 10 in the plane view is stuck on the surface of the substrate 10. A bonding pad 16 is formed on the circumferential part of the image pickup area on the surface of the semiconductor substrate, and a through hole 26 penetrating from the lower surface of the bonding pad 16 to a rear surface 24 of the semiconductor substrate 10 is formed in the semiconductor substrate 10. The inner surface of the through hole 26 is coated with an insulating film 28, and the rear surface 24 of the semiconductor substrate 10 is coated with an insulating film 30. A through hole 26 is filled with a conductive material 38, and the bonding pad 16 is electrically connected to a copper wiring 34 of a flexible circuit board 8 stuck on the rear surface 24. |
