发明名称 PLATED RESIN MOLDING AND PROCESS FOR PRODUCING THE SAME
摘要 <p>A process for producing a plated resin molding by plating the surface of a thermoplastic resin molding with a metal, which satisfies any of the following requirements 1, 2, and 3: 1 the thermoplastic resin molding comprises a thermoplastic resin and a water-soluble substance and the process includes the step of degreasing the resin molding and the step of electroless plating and does not include the step of etching with an acid containing a heavy metal 2 the thermoplastic resin molding comprises a polyamide resin and a styrene resin and the process includes the step of degreasing the resin molding and the step of electroless plating and does not include the step of etching with an acid containing a heavy metal and 3 the process includes as a pretreatment for a metal plating step, a step in which the thermoplastic resin molding is treated by contact with an acid or base containing no heavy metals. Also provided is a plated resin molding obtained by the process. In the plated resin molding, the deposit layer has high adhesion strength although etching with chromic acid was not conducted.</p>
申请公布号 WO03023087(A1) 申请公布日期 2003.03.20
申请号 WO2002JP09231 申请日期 2002.09.10
申请人 DAICEL POLYMER LTD.;TAI, TOSHIHIRO;TONOSAKI, IPPEI 发明人 TAI, TOSHIHIRO;TONOSAKI, IPPEI
分类号 C23C18/20;(IPC1-7):C23C18/20;C08J7/06 主分类号 C23C18/20
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