发明名称 A METHOD AND APPARATUS FOR PROCESSING A WAFER
摘要 A method of a single wafer wet/dry cleaning apparatus comprising: a transfer chamber having a wafer handler contained therein; a first single wafer wet cleaning chamber directly coupled to the transfer chamber; and a fist single wafer ashing chamber directly coupled to the transfer chamber.
申请公布号 WO03021642(A2) 申请公布日期 2003.03.13
申请号 WO2002US27573 申请日期 2002.08.28
申请人 APPLIED MATERIALS, INC. 发明人 VERHAVERBEKE, STEVEN;TRUMAN, J., KELLY;LANE, CHRISTOPHER, T.;SOMEKH, SASSON, R.
分类号 H01L21/00 主分类号 H01L21/00
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