| 摘要 |
A thermoelectric device useful for cooling comprising: a plurality of N-type thermoelectric semiconductor elements; a plurality of P-type thermoelectric semiconductor elements; metal junctions between horizontally adjacent semiconductor elements; special layers between vertically adjacent N-type thermoelectric semiconductor elements and between vertically adjacent P-type thermoelectric semiconductor elements; a cold pole; at least two heat sinks; and a source of direct current power interconnected so as to pump electrons from the N-type semiconductors to the P-type semiconductors, or to pump hole s from the P-type semiconductors to the N-type semiconductors, such that the heat buildup is distributed among more than one heat sink.
|
