| 发明名称 |
Shapes-based migration of aluminum designs to copper damascene |
| 摘要 |
An interconnect structure for use in semiconductor devices which interconnects a plurality of dissimilar metal wiring layers, which are connected vias, by incorporating shaped voids in the metal layers. The invention also discloses a method by which such structures are constructed.
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| 申请公布号 |
US6528883(B1) |
申请公布日期 |
2003.03.04 |
| 申请号 |
US20000670411 |
申请日期 |
2000.09.26 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DUNHAM TIMOTHY G.;HALL EZRA D. B.;LANDIS HOWARD S.;LAVIN MARK A.;LEIPOLD WILLIAM C. |
| 分类号 |
H01L21/768;H01L23/528;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L21/768 |
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