METHOD OF MANUFACTURING THIN FILM SHEET WITH BUMPS AND THIN FILM SHEET WITH BUMPS

摘要

A method of manufacturing a thin film sheet(24)with bumps,comprising the steps of forming a plurality of through holes(36)in the thin film sheet(24),stacking a positive dry film(38)and the thin film sheet(24)on a substrate(32),applying exposure processing to the surface of the thin film sheet(24)to expose the dry film(38)exposed to the insides of the through holes(36),forming through holes(40)communicating with the through holes(36)in the thin film sheet(24)by applying a development treatment to the dry film and removing an exposed portion(38a),applying a plating treatment to the surface of the thin film sheet(24)and forming bumps(26)allowing the through holes(36)to communicate with the through holes(40),and projecting the tip parts(27)of the bumps(26)from the surface of the thin film sheet(24)by peeling off the thin film sheet(24)together with the bumps(26)from the dry film(38).