| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a soldering method, a printed wiring board, a soldering equipment and a soldering temperature regulator in which thermal stress being imposed to an electronic component is relaxed when it is mounted on a printed board and soldered thereto with regard to an auxiliary heating technology of the printed board. SOLUTION: A heating pattern is formed on the outer layer of a printed wiring board using a material of good thermal conductivity and when an electronic component is soldered to the printed board, the printed board is heated using the heating pattern. As means for heating the printed board, a soldering temperature regulator serving as a soldering equipment or jig heats up the heating pattern or supplies power thereto.</p> |
