发明名称 ELECTRONIC COMPONENT SET AND LEAD FRAME
摘要 PROBLEM TO BE SOLVED: To improve the positional accuracy of an electronic component, without having to bring about positional deviation of the component by integrally forming leads with a frame, and to simply and efficiently mount the component without requiring for taping mounting paper, taping step or the like, as in prior art. SOLUTION: Electronic component set 10 comprises leads 20 each for constituting an electronic component 12 to be formed integrally with a frame 14. The plurality of frames 14 are aligned linearly in parallel to be coupled by an adhesive tape 18 to be formed in a long band-like shape. Feeding holes 16 and the components 12 are disposed at predetermined interval in the longitudinal direction. The set 10 also comprises a lead frame 32 formed of the coupled frames 14, so as to serve as a conveyor at a mounting time.
申请公布号 JP2003037233(A) 申请公布日期 2003.02.07
申请号 JP20010221061 申请日期 2001.07.23
申请人 ROHM CO LTD 发明人 OKAZAKI TADAHIRO
分类号 H01L23/48;H01L33/56;H01L33/62 主分类号 H01L23/48
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