| 摘要 |
PROBLEM TO BE SOLVED: To reduce the occurrence of erroneous mounting of a semiconductor device and semiconductor module. SOLUTION: A first solder ball 13 and a second solder ball 14 of different fusing points are joined to each connecting electrode 12 provided at the rear surface of a semiconductor package 11 of the semiconductor device 10. The first solder ball 13 of lower fusing point is provided in the external circumferential side of the semiconductor device 10, while the second solder ball 14 of higher fusing point in the internal circumferential side. A contact point 22 is provided on a base substrate 21, the semiconductor device 10 is allocated on a mounting substrate 20 in which solder paste 23 is printed on the contact point 22, and a reflow soldering process is conducted in which the semiconductor device 10 is heated up to a first temperature at which the first solder ball 13 is fused and is then heated up to a second temperature at which the second solder ball 14 and solder paste 23 are fused. |
