| 摘要 |
An electronic device such as a laser diode (102) is mounted on a heatsink assembly (126, 128) within a TO-can package. The TO-can package is coupled to a thermal sink (146), such as a printed circuit board or housing, by a thermal conductor. The thermal conductor is in the form of a thermal clip (140), a flexible strap (404) or alternatively a heat pipe (306). Thus, heat energy is efficiently conducted away from devices within the TO-can package (402).
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