发明名称 |
Compound semiconductor device and manufacturing method thereof |
摘要 |
In a method of manufacturing a compound semiconductor device, individual chip patterns are projected onto a (1 0 0) surface of a GaAs wafer so that the columns and rows of the chip patterns are aligned in a direction slanting by 45 degrees with respect to a [O 1 1] direction of the GaAs wafer. The wafer is diced along this slanting direction and chipping along the edges of the individual separated chips is greatly reduced. |
申请公布号 |
US2003017644(A1) |
申请公布日期 |
2003.01.23 |
申请号 |
US20020189775 |
申请日期 |
2002.07.08 |
申请人 |
SANYO ELECTRIC CO., LTD. |
发明人 |
ASANO TETSURO;UEKAWA MASAHIRO;HIRATA KOICHI;SAKAKIBARA MIKITO |
分类号 |
G03F1/08;G03F1/00;G03F1/70;G03F7/20;H01L21/027;H01L21/301;H01L21/304;H01L29/04;H01L29/80;(IPC1-7):H01L21/301;H01L21/44 |
主分类号 |
G03F1/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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