发明名称 |
Semiconductor device including edge bond pads assemblies including the same and related methods |
摘要 |
A semiconductor device including at least one contact pad disposed on an edge thereof. The semiconductor device may also include a protective overcoat layer. The present invention also includes a method of fabricating the semiconductor device, including forming disconnected notches in a semiconductor wafer, redirecting circuit traces into each of the notches, and singulating the semiconductor wafer along the notches to form bond pads on the edges of the resultant semiconductor devices. A method of attaching the semiconductor device to a carrier substrate includes orienting the semiconductor device nonparallel to a carrier substrate and establishing at least one electrical connection between the semiconductor device and the carrier substrate. |
申请公布号 |
US2003003689(A1) |
申请公布日期 |
2003.01.02 |
申请号 |
US20020230748 |
申请日期 |
2002.08.29 |
申请人 |
FARNWORTH WARREN M.;KINSMAN LARRY D.;MODEN WALTER L. |
发明人 |
FARNWORTH WARREN M.;KINSMAN LARRY D.;MODEN WALTER L. |
分类号 |
H01L21/60;H01L23/485;(IPC1-7):H01L21/46 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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