发明名称 |
System for cooling a component in a computer system |
摘要 |
A system for cooling a component in a computer system is disclosed. The cooling system of the present invention comprises a heat collection chamber including an inlet opening and an outlet opening, wherein the inlet opening is located in a position vertically higher than a location of the outlet opening. The system includes a heat conductive jacket adapted to be in thermal contact with the component. The jacket includes an inlet port and an outlet port through which a cooling fluid circulates. The system also includes a first hollow tube for coupling the outlet port to the inlet opening, and a second hollow tube for coupling the outlet opening to the inlet port.
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申请公布号 |
US2002196604(A1) |
申请公布日期 |
2002.12.26 |
申请号 |
US20010887740 |
申请日期 |
2001.06.22 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
LEHMAN BRET W.;MATTESON JASON AARON;WHITE GRAHAM MICHAEL |
分类号 |
H01L23/473;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/473 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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