A METHOD OF FORMING FLEXIBLE INSULATION PROTECTION FILM OF FLEXIBLE CIRCUIT BOARD AND FLEXIBLE CIRCUIT BOARD FORMED WITH FLEXIBLE INSULATION PROTECTION FILM AND PRODUCTION METHOD THEREFOR

摘要

A method of forming a flexible insulation protection film of a flexible circuit board, which satisfies various characteristics required for the coating materials of a flexible circuit board, and which is characterized by comprising the steps of forming, into a thermosetting resin composition film via thermosetting resin composition varnish, a thermosetting resin composition that contains an A component compound having a specified number average molecular weight and a specified functional group equivalent weight, and a B component compound having a specified number average molecular weight and a specified functional group equivalent weight, and that has an average of combined functional group equivalent weights of the A component compound and the B component compound of 300−1200 g/eq., and of pasting the thermosetting resin composition film to the flexible circuit board.