| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy-based resin composition excellent in crack resistance and adhesiveness. SOLUTION: This epoxy-based resin composition for a semiconductor-sealing containing (A) an epoxy resin, (B) a curing agent, (C) a filler and (D) a curing accelerator as essential components is characterized by using the above epoxy resin (A) containing >=80 wt.% 2-functional epoxy compound based on (A) the above epoxy resin, the above curing agent (B) containing 15-70 wt.% 2-functional phenolic curing agent expressed by the following chemical formula (I) based on (B) the curing agent and the above filler (C) containing >=80 wt.% spherical silica based on (C) the filler, and also having 80-96 wt.% ratio of (C) the filler based on the total of the resin composition. |
