发明名称 |
WIRING BOARD WITH SOLDER BALL AND ITS MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which is equipped with solder balls excellent in connection reliability after a thermal treatment and its manufacturing method. SOLUTION: An electrolytic nickel alloy plating film and an electroless gold plating film are successively formed on a conductor terminal, a wiring board is equipped with the above conductor terminal and a solder ball that has such a certain composition which never increases in shear strength by 10% or above by a thermal treatment and is formed on the above conductor terminal, and a solder ball connection terminal is mounted with a solder ball. A wiring board manufacturing method is that solder paste having such a composition which hardly increases in shear strength by 10% or above by a thermal treatment is applied onto a board equipped with a conductor terminal successively coated with an electrolytic nickel alloy plating film and an electroless alloy film and melted into a solder ball by heating.
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申请公布号 |
JP2002280730(A) |
申请公布日期 |
2002.09.27 |
申请号 |
JP20010082978 |
申请日期 |
2001.03.22 |
申请人 |
HITACHI CHEM CO LTD |
发明人 |
NODO TAKAAKI;HASEGAWA KIYOSHI;TAKAHASHI AKIO |
分类号 |
B23K1/00;B23K3/06;H01L23/12;H05K3/24;H05K3/34;(IPC1-7):H05K3/34 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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