发明名称 |
METHOD FOR MANUFACTURING ARRAY BOARD FOR DISPLAY |
摘要 |
PROBLEM TO BE SOLVED: To reduce the number of manufacturing processes to reduce a manufacturing cost and improve manufacturing efficiency in a process of manufacturing a planar display array board having contact holes 51, 16 piercing a resin layer insulation film 5 at identical points and a gate insulation film 15. SOLUTION: A manufacturing method is constituted by forming a gate insulation film 15 from a silicon nitride film only, forming a pattern of a resin layer insulation film 5 by an exposure and development operation and forming contact holes 16 piercing the gate insulation film 15 with use of the pattern of the resin layer insulation film 5 as a mask by inductively coupled plasma etching at low pressure (of 0.13-1.5 Pa (1-10 mTorr)) enough to avoid the side etching of the gate insulation film 15, using etching gas not containing oxygen (SF6 /N2 / He) so that the corrosion of a metal layer surface at each of other contact holes 52, 53 piercing the resin layer insulation film 5 is suppressed to a minimum.
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申请公布号 |
JP2002280567(A) |
申请公布日期 |
2002.09.27 |
申请号 |
JP20010083585 |
申请日期 |
2001.03.22 |
申请人 |
DISPLAY TECHNOLOGIES INC;TFPD KK |
发明人 |
HORINO SHIGEKAZU;OKAJIMA KENJI |
分类号 |
G02F1/1368;G09F9/00;G09F9/30;H01L21/302;H01L21/3065;H01L21/336;H01L21/768;H01L29/786;(IPC1-7):H01L29/786;H01L21/306;G02F1/136 |
主分类号 |
G02F1/1368 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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