发明名称 |
Matching unit and plasma processing system |
摘要 |
There are provided a matching unit capable of sufficiently matching the impedance of a high frequency load to a transmission path impedance without increasing its size and matching time even if a high frequency power of 70 MHz or higher is supplied thereto, and a plasma processing system using the same. A matching unit 41 comprises: a resonance rod 61 for transmitting a high frequency energy from a high frequency power supply 40 to a plasma producing electrode; a variable capacitor 62, connected to the resonance rod 61 and an electrode 21 in series, for adjusting the imaginary part of an impedance complex number; a housing 63 which is provided outside of the resonance rod 61 and which is grounded; a link coil 64 for exciting a high frequency energy to the resonance rod 61 and for adjusting the real part of the impedance complex number; and a controller 69 for controlling a driving part for the variable capacitor 62 and the link coil 64 so that a series resonance circuit is formed between the high frequency power supply 40 and the ground via plasma in a matching state.
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申请公布号 |
US2002134508(A1) |
申请公布日期 |
2002.09.26 |
申请号 |
US20020120526 |
申请日期 |
2002.04.12 |
申请人 |
HIMORI SHINJI;YUASA MITSUHIRO;WATANABE KAZUYOSHI;SHIMADA JUN?APOS,ICHI |
发明人 |
HIMORI SHINJI;YUASA MITSUHIRO;WATANABE KAZUYOSHI;SHIMADA JUN?APOS,ICHI |
分类号 |
H01L21/302;C23C16/505;H01J37/32;H01L21/3065;H03H7/40;H05H1/46;(IPC1-7):C23F1/00;C23C16/00;H01L21/306 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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