| 摘要 |
PURPOSE: An automatic packing apparatus for a semiconductor device is provided to increase the productivity by reducing failure rate with packing automatically, and to prevent injury and to relieve fatigue by decreasing working hours. CONSTITUTION: An automatic packing machine(100) for a semiconductor device is composed of a package loading part(110) loading a packing container(20); a tray loading part(120) loading a tray bundle(10) including plural trays; a dry packing part(130) packing by inserting the tray bundle into the packing container; a packing container insertion part(150); a packing container unloading part discharging the finished packing container including the tray bundle; and first and second transfer units(171,181) moving the packing container into the dry packing, and the tray bundle into the packing container insertion part. Injury of a worker is prevented, and the failure rate is minimized with packing the semiconductor device automatically.
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