发明名称 EQUIPMENT AND METHOD FOR LASER MACHINING
摘要 <p>PROBLEM TO BE SOLVED: To provide equipment and method for laser machining which has excellent machining quality and high machinability. SOLUTION: The equipment is provided with multiple pulse laser oscillators 1101a and 1101b, means 1102a and 1102b for driving the pulse laser oscillators successively by shifting respective oscillation phases and a means 1109 for branching respective beams 1104a and 1104b emitted from the pulse laser oscillators into a plurality of beams, and irradiates workpiece with the plurality of beams obtained by the branching means.</p>
申请公布号 JP2002263876(A) 申请公布日期 2002.09.17
申请号 JP20020006735 申请日期 2002.01.15
申请人 SEIKO EPSON CORP 发明人 AMAKO ATSUSHI;MURAI MASAMI;SONEHARA TOMIO;OTA TSUTOMU
分类号 B23K26/06;B23K26/067;B23K101/42;(IPC1-7):B23K26/06 主分类号 B23K26/06
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