发明名称 |
EQUIPMENT AND METHOD FOR LASER MACHINING |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide equipment and method for laser machining which has excellent machining quality and high machinability. SOLUTION: The equipment is provided with multiple pulse laser oscillators 1101a and 1101b, means 1102a and 1102b for driving the pulse laser oscillators successively by shifting respective oscillation phases and a means 1109 for branching respective beams 1104a and 1104b emitted from the pulse laser oscillators into a plurality of beams, and irradiates workpiece with the plurality of beams obtained by the branching means.</p> |
申请公布号 |
JP2002263876(A) |
申请公布日期 |
2002.09.17 |
申请号 |
JP20020006735 |
申请日期 |
2002.01.15 |
申请人 |
SEIKO EPSON CORP |
发明人 |
AMAKO ATSUSHI;MURAI MASAMI;SONEHARA TOMIO;OTA TSUTOMU |
分类号 |
B23K26/06;B23K26/067;B23K101/42;(IPC1-7):B23K26/06 |
主分类号 |
B23K26/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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