发明名称 |
Thermosetting resin composition and use thereof |
摘要 |
<p>A thermosetting resin composition comprising (1) a copolymer resin comprising (a) a monomer unit and (b) a monomer unit respectively represented by the following general formulae (I) and (II): <CHEM> wherein R<1> represents hydrogen, a halogen, or a C1-C5 hydrocarbon group; R<2> represents a halogen or a C1-C5 hydrocarbon group; x is 0 to 3; and each of m and n is a natural number, and (2) a cyanate resin having at least two cyanate groups per molecule. To provide a printed wiring board material and a printed wiring board for electronic appliance, having a low dielectric constant and a low dielectric dissipation factor as well as improved heat resistance.</p> |
申请公布号 |
EP1229079(A1) |
申请公布日期 |
2002.08.07 |
申请号 |
EP20020001902 |
申请日期 |
2002.01.30 |
申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
TSUCHIKAWA, SHINJI;KOBAYASHI, KAZUHITO;MIZUNO, YASUYUKI;FUJIMOTO, DAISUKE;TAKANO, NOZOMU |
分类号 |
C08L25/08;C08L35/06;C08L63/00;C08L79/04;H05K1/03;(IPC1-7):C08L35/06;C08L25/00 |
主分类号 |
C08L25/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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