发明名称 LASER MACHINING METHOD, LASER MACHINING DEVICE AND CONTROL METHOD OF LASER MACHINING
摘要 This is to present a laser machining method and a laser machining apparatus for drilling holes, capable of achieving conduction securely between adjacent conductive layers, by detecting the machining state of a workpiece adequately, and controlling the machining. For this purpose, the number of laser pulse outputs capable of machining securely is preset. During laser machining, reflected laser beam intensity from the workpiece and incident laser beam intensity are detected, and the machining state of the workpiece is detected. As a result, when judging the workpiece has reached a desired machining state, laser machining is finished if the number of times of laser machining has not reached the set number of laser pulse outputs. If it is judged that the workpiece has not reached the desired machining state, laser machining is finished when reaching the set number of laser pulse outputs. As a result, the laser machining method and laser machining apparatus capable of drilling holes of high quality at high yield and shortening the machining cycle time can be realized. <IMAGE>
申请公布号 EP0980737(A4) 申请公布日期 2002.07.31
申请号 EP19980959152 申请日期 1998.12.10
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 ISAJI, KAZUHIDE;KARASAKI, HIDEHIKO;KINOSHITA, HISASHI;KATO, MAKOTO
分类号 B23K26/03;B23K26/06;B23K26/38;H05K1/02;H05K3/00 主分类号 B23K26/03
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