VERTICAL-TYPE WAFER SAWING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a wafer sawing device which is small in floor area and capable of effectively removing silicon swarf and dust produced in a wafer sawing process. SOLUTION: A vertical wafer sawing device 100 is used to cut a wafer into separate chips and equipped with a chuck table 111 which is provided with a first plane where the wafer is mounted and a second plane which is connected to a drive means. The first and second planes are arranged nearly vertical to the support plane of the chuck table 111, and the wafer 11 is cut off by cutting teeth 121 while being held vertical to the ground. Therefore, the device 100 is not required to spread horizontal in area and can be reduced in floor area.