| 发明名称 |
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE |
| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve outward appearance quality and to lower a cost. SOLUTION: After resin sealing, a lead 1a on the backside 3a of a sealing part 3 is irradiated with laser light to remove resin burrs 8 and expose a connected surface 1g of the lead 1a, thereby improving the outward appearance quality of QFN and lowering the cost.</p> |
| 申请公布号 |
JP2002184795(A) |
申请公布日期 |
2002.06.28 |
| 申请号 |
JP20000380048 |
申请日期 |
2000.12.14 |
| 申请人 |
HITACHI LTD;HITACHI YONEZAWA ELECTRONICS CO LTD |
发明人 |
SHIMANUKI YOSHIHIKO;KOBAYASHI SHOICHI |
| 分类号 |
H01L23/12;H01L21/56;H01L23/00;(IPC1-7):H01L21/56 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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