| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal deposition acceleration compound in plating liquid, a plating liquid containing this compound and a substitution plating method using this plating liquid. SOLUTION: The metal deposition acceleration compound in plating liquid which is a water-soluble saccharide having >=1 cation-formable groups is disclosed and this compound is added to a plating liquid, thereby, a metal deposition rate in plating treatment is improved. As a result, in the case the plating treatment of substrates, such as printed circuit boards, which is heretofore liable to form nonuniform films, the formation of the uniform films is made possible.
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