发明名称 |
Thin, small-sized power semiconductor package |
摘要 |
A power semiconductor package is provided. The power semiconductor package includes a chip, leads, conductive media, and a molding material. The leads have a groove in the shape of a hemisphere or a down-set. The package further includes an adhesive. The package can increase solder joint reliability and thermal performance. Also, the size of the package can be reduced, and sawing can be performed so that a burr does not occur.
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申请公布号 |
US2002074634(A1) |
申请公布日期 |
2002.06.20 |
申请号 |
US20010896120 |
申请日期 |
2001.07.02 |
申请人 |
CHOI YOON-HWA;NAM SHI-BAEK |
发明人 |
CHOI YOON-HWA;NAM SHI-BAEK |
分类号 |
H01L23/31;H01L23/495;(IPC1-7):H01L23/02 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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