Determination of the properties, including thickness, of individual layers of a multi-layer structure by measurement of reflected radiation from a thermal shock wave applied to the surface of the structure

摘要

Method for checking the properties of individual layers of a multi-layer structure using reflected infrared radiation. Accordingly an energy pulse is used to apply a thermal shock wave of a given spectral width to the surface of the layer. From a 3-D diagram of spectral alterations in reflected radiation, conclusions can be made about layer thicknesses, defects, such as lack of adhesion and other properties. An Independent claim is made for a device for checking the properties of individual layers of a multi- layer structure based on a CMOS infrared sensing camera.