发明名称 |
Grinding method, semiconductor device and method of manufacturing semiconductor device |
摘要 |
A surface of a wafer (semiconductor substrate) is subjected to grinding by rotating it and bringing it into contact with a rotating grinding wheel. The grinding wheel is rotated in a first direction at a rotating speed N1. The wafer is rotated in a second direction which is opposite to the first direction at a rotating speed N2, wherein a value of N2/N1 is in the range of 0.006 to 0.025. The wafer is then carried from the grinding process to a dicing process while being maintained in a horizontal position by using a wafer handling jig to prevent the breakage of the wafer. A flash etching process may also be used at the end of the grinding process.
|
申请公布号 |
US6406357(B1) |
申请公布日期 |
2002.06.18 |
申请号 |
US20000522464 |
申请日期 |
2000.03.09 |
申请人 |
HITACHI, LTD. |
发明人 |
KAZUI SHINICHI;SHIRASE KAZUO;MORITA KENJI;SASAKI HIDEAKI;ODASHIMA HITOSHI |
分类号 |
B24B7/04;B24B1/00;B28D5/00;H01L21/301;H01L21/304;H01L21/683;(IPC1-7):B24B1/00 |
主分类号 |
B24B7/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|