| 摘要 |
PROBLEM TO BE SOLVED: To improve wiring properties and at the same time effectively obtain noise reduction effect. SOLUTION: A first LSI chip 11 mounts an LSI chip, and has a first LSI chip pad 12 that is arranged in a lattice shape over an entire surface. A second LSI chip 13 has a smaller area than the first LSI chip, has signal wiring 15 to a signal from the first LSI chip, and has a second LSI chip pad 14 that opposes the first LSI chip pad on one surface. The second LSI chip has a decoupling capacitor 16 for the decrease in noise in the first LSI chip. A packaging substrate 17 has a packaging substrate pad 18 that opposes the first LSI chip pad on one surface excluding a surface to the second LSI chip surface. The first LSI chip and the second LSI chip are bonded via the pads 12 and 14, and the first LSI chip and the packaging substrate are melted and connected by a solder ball 9 attached to the first LSI chip pad 12.
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