| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer polishing apparatus in which a retainer ring can be stably rotated. SOLUTION: A wafer holding head 14 for holding a wafer W comprises a head main body 22, a carrier 24 and a retainer ring 28. The carrier 24 is rotated in such a manner that the rotation of the body 22 is transmitted via pins 48, and the ring 28 is rotated in such a manner that the rotation of the carrier 24 is transmitted via pins 62. The transmission of the rotation to the ring 28 is performed in the vicinity of a polishing turn table 12, thereby rotating the ring 28 stably. |
