METHOD FOR MANUFACTURING BLIND VIA HOLE OF BUILD-UP PRINTED CIRCUIT BOARD

摘要

PURPOSE: A method for manufacturing a blind via hole of a build-up PCB(Printed Circuit Board) is provided to increase the adhesion force and quality of plating by removing residues on a pattern of a lower PCB through a sulphuric acid containing a surface active agent and performing the removal of the residues through an oxidant upon forming the blind via hole. CONSTITUTION: A blind via hole is formed(ST200). The blind via hole has the depth from an upper build-up PCB to a lower build-up PCB. An ion material is injected into the blind via hole in order to remove residues of an insulating layer that is adhered on a pattern after forming the blind via hole(ST300). The ion material is a mixture of a surface active agent and an oxidant. An oxidant is injected into the residues of the insulating layer, which remain on the pattern after the injection of the ion material, to thereby remove them(ST400,ST500). A neutralizer is added to the blind via hole that is acidified by the injection of the oxidant, to thereby neutralize the blind via hole acidified(ST600). The neutralized blind via hole is plated(ST700).