| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board which is uniform in thickness, equipped with conductor patterns that can be easily given interlayer continuity, and provided with a pattern forming plating whose thickness is not required to be regulated and a method of manufacturing the same. SOLUTION: A printed wiring board manufacturing method comprises first process of feeding conductive material 5 on the surfaces of first conductive pads 20 formed on the metal layer 22 of a carrier 3, second process of obtaining a laminated board 84 by forming an insulating resin layer 1 on the surfaces of the conductive materials 5 and making the conductive materials 5 protrude through the insulating resin layer 1 so as to be partially exposed through the insulating resin layer 1, third process of laminating another wiring board 83 where second conductive pads 70 are provided on the laminated board 84 to bring the conductive materials 5 into contact with the second conductive pads 70, fourth process of curing the insulating resin layer 1 under pressure, and fifth process of removing the carrier 3 and the metal layer 22.
|
