发明名称 PHOTOSENSITIVE EPOXY RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive epoxy resin composition which is low dielectric loss tangent capable of developing in the noncombustible aqueous solution. SOLUTION: This photosensitive epoxy resin composition comprises (a) 40-70 pts.wt. multifunctional epoxy resin, (b) 30-60 pts.wt. phenolic hydroxy group- containing resin and 1-10 pts.wt., based on the sum of (a) and (b) of 100 pts.wt., photo acid generation agent and is characterized by using a resin having an alicyclic structure as at least the (b) component.
申请公布号 JP2002069159(A) 申请公布日期 2002.03.08
申请号 JP20000266000 申请日期 2000.08.30
申请人 HITACHI LTD;HITACHI CHEM CO LTD 发明人 AMO SATORU;KAWAMOTO MINEO;AKABOSHI HARUO;FUKAI HIROYUKI;IRINO TETSUO
分类号 C08K3/00;C08G59/62;C08K5/00;C08L63/00;C08L63/10;(IPC1-7):C08G59/62 主分类号 C08K3/00
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