发明名称 |
PHOTOSENSITIVE EPOXY RESIN COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive epoxy resin composition which is low dielectric loss tangent capable of developing in the noncombustible aqueous solution. SOLUTION: This photosensitive epoxy resin composition comprises (a) 40-70 pts.wt. multifunctional epoxy resin, (b) 30-60 pts.wt. phenolic hydroxy group- containing resin and 1-10 pts.wt., based on the sum of (a) and (b) of 100 pts.wt., photo acid generation agent and is characterized by using a resin having an alicyclic structure as at least the (b) component.
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申请公布号 |
JP2002069159(A) |
申请公布日期 |
2002.03.08 |
申请号 |
JP20000266000 |
申请日期 |
2000.08.30 |
申请人 |
HITACHI LTD;HITACHI CHEM CO LTD |
发明人 |
AMO SATORU;KAWAMOTO MINEO;AKABOSHI HARUO;FUKAI HIROYUKI;IRINO TETSUO |
分类号 |
C08K3/00;C08G59/62;C08K5/00;C08L63/00;C08L63/10;(IPC1-7):C08G59/62 |
主分类号 |
C08K3/00 |
代理机构 |
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