| 摘要 |
PURPOSE: A semiconductor device is provided to improve reliability by improving the adhesion strength of a metal plate or connecting chip, the plurality of electrodes and a lead frame with a molding resin. CONSTITUTION: A semiconductor device includes a semiconductor chip having electrodes; wiring materials having lead terminals; a metal plate electrically connecting electrodes and lead terminals; and a molding resin for sealing the semiconductor chip, parts of the wiring materials, and the metal plate, characterized in that the surface of the metal plate is roughened and joined to the molding resin. |
