| 摘要 |
A method and apparatus for measuring a property (e.g., thickness or composition) of at least one film in a sample (e.g., a multilayer film stack contained in a microelectronic device) is disclosed. The method features the steps of generating a coherent x-ray pulse, delivering the coherent x-ray pulse to a region on the sample to generate a signal beam, detecting the signal beam to generate an electrical signal, and analyzing the electrical signal to determine the property (e.g., thickness) of the film.
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