| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem in the conventional apparatuses that the testing cost of a semiconductor device is high and it is necessary to ensure preserving space of a testing fixture. SOLUTION: A connection part 24, having a plurality of pads, is provided to a test board 21. A plurality of anisotropic conductive sheets 251, 252, 253, a power supply sheet 26 and a grounding sheet 27 are arranged alternately on the connection part 24. The connection part 24 and the semiconductor device 23 are connected via the anisotropic conductive sheets 251, 252, 253, the power supply sheet 26 and the grounding sheet 27 and the power supply sheet 26 and the grounding sheet 27 are replaced, corresponding to the pin arrangement of the semiconductor device 23.
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