发明名称 DOUBLE-SIDED CIRCUIT BOARD AND MULTILAYER WIRING BOARD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a double-sided circuit board that can secure high connection reliability and is lighter than a double-sided circuit board where a metal core is arranged as a core. SOLUTION: An insulating layer 2 is laminated on both surfaces of a core layer 1 that is made of carbonaceous fibers and an organic macromolecular resin for its binder, and a wiring conductor 3a is provided on both surfaces of the insulating layer 2.
申请公布号 JP2001332828(A) 申请公布日期 2001.11.30
申请号 JP20000155102 申请日期 2000.05.25
申请人 NITTO DENKO CORP 发明人 OTA SHINYA;KANETO MASAYUKI;OKEYUI TAKUJI;NAKAMURA KEI
分类号 H05K1/11;H05K1/03;H05K3/46;(IPC1-7):H05K1/11 主分类号 H05K1/11
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