发明名称 |
DOUBLE-SIDED CIRCUIT BOARD AND MULTILAYER WIRING BOARD USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a double-sided circuit board that can secure high connection reliability and is lighter than a double-sided circuit board where a metal core is arranged as a core. SOLUTION: An insulating layer 2 is laminated on both surfaces of a core layer 1 that is made of carbonaceous fibers and an organic macromolecular resin for its binder, and a wiring conductor 3a is provided on both surfaces of the insulating layer 2. |
申请公布号 |
JP2001332828(A) |
申请公布日期 |
2001.11.30 |
申请号 |
JP20000155102 |
申请日期 |
2000.05.25 |
申请人 |
NITTO DENKO CORP |
发明人 |
OTA SHINYA;KANETO MASAYUKI;OKEYUI TAKUJI;NAKAMURA KEI |
分类号 |
H05K1/11;H05K1/03;H05K3/46;(IPC1-7):H05K1/11 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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