COATING DEVELOPING SYSTEM AND METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a coating developing system having a function capable of removing impurities of a molecular level such as oxygen or the like adhering to a wafer. SOLUTION: A passing part 5 is provided between an interface 4 and an exposure unit 6 of the coating developing system 1. The passing part 5 has a first path 60 where a wafer W passes when it is carried from the interface 4 to the exposure unit 6, and a second path 61 where the wafer W passes when it is carried from the exposure unit 6 to the interface 4. The first path 60 is provided with a pressure reducing removing unit 65 for reducing the pressure in a chamber and removing impurities in the chamber. The wafer W before exposure processing is carried into a pressure reducing removing unit 65 where impurities adhering to the wafer W are removed, and also solvent in a resist liquid on the wafer W can be evaporated at the same time.