发明名称 SiGe FILM FORMING METHOD, METHOD OF MANUFACTURING HETEROJUNCTION TRANSISTOR AND HETEROJUNCTION BIPOLAR TRANSISTOR
摘要 PROBLEM TO BE SOLVED: To prevent an SiGe film on an insulating film from becoming rough and to improve film quality and film resistance in an SiGe film forming method, a manufacturing method of a heterojunction transistor and a heterojunction bipolar transistor. SOLUTION: A method for forming a SiGe film 8 on the insulating film 6 is provided with a buffer forming process for forming a first Si(1-x)Gex film 9 (0<=x<0.05) on the insulating film and a main film forming process for forming a second Si(1-y)Gey film 10 (0.05<=y<1) on the first Si(1-x)Gex film. The buffer forming process forms the first Si(1-x)Gex in the thickness range of 0.5 nm to 5 nm.
申请公布号 JP2001319935(A) 申请公布日期 2001.11.16
申请号 JP20000138994 申请日期 2000.05.11
申请人 MITSUBISHI MATERIALS SILICON CORP;MITSUBISHI MATERIALS CORP 发明人 SHIONO ICHIRO;MIZUSHIMA KAZUKI
分类号 H01L21/28;H01L21/205;H01L21/3205;H01L21/331;H01L23/52;H01L29/165;H01L29/73;H01L29/737;(IPC1-7):H01L21/331;H01L21/320 主分类号 H01L21/28
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