发明名称 |
METHOD AND SYSTEM OF MEASURING WAVINESS IN SILICON WAFERS |
摘要 |
<p>A method and system of measuring waviness of a silicon wafer. A memory stores data representative of the shape of the wafer at a plurality of positions on the wafer and a processor processes the data to determine a waviness parameter. The processor defines an inspection surface as a function of the data and calculates deviations between the inspection surface and a first reference plane at a plurality of positions on the inspection surface. The processor further defines a plurality of localized sites on the wafer and calculates deviations between the inspection surface and a second reference plane at a plurality of positions on the inspection surface for each site. The second reference plane is a function of the calculated deviations between the inspection surface for each site and the first reference plane. The processor then defines a waviness parameter for each site as a maximum variance of the calculated deviations between the inspection surface and the second reference plane.</p> |
申请公布号 |
WO0052420(A9) |
申请公布日期 |
2001.10.25 |
申请号 |
WO2000US03078 |
申请日期 |
2000.02.07 |
申请人 |
MEMC ELECTRONIC MATERIALS, INC. |
发明人 |
WITTE, DALE, A. |
分类号 |
H01L21/66;(IPC1-7):G01B21/30 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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