| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board and electronic equipment that can be made as compact as possible. SOLUTION: The printing wiring plate 2 is provided with an electric inspection land 2c on the resin coating area 2A of a mounting face 2a, and an electric inspection contact 5 whose part exposes to the outside of a resin 4 is provided on the electric inspection land 2c. In addition, an electronic circuit unit (electronic equipment) 1 is constituted by providing the electric inspection land 2c on the resin coating area 2A of the mounting face 2a, and mounting a semiconductor chip (electronic part) 3 on the printed wiring board 2 whereupon the electric inspection contact 5 is provided with its part exposed to the outside of the resin 4 on the electric inspection land 2c. |
