EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing semiconductors capable of reducing the warpage of a package and good in curability. SOLUTION: This epoxy resin composition for sealing the semiconductors is characterized as comprising (A) an epoxy resin, (B) a phenol resin, (C) an inorganic filler and (D) a mixture prepared by melt mixing dicyandiamide having 0.1-10μm average grain diameter with a phenol resin in (1:1) to (1:10) weight ratio of the dicyandiamide to the phenol resin.